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Which packaging technology enables 3D stacking of chips for higher performance?
- Wire Bonding
- Flip-Chip
- Through-Silicon Via
- Plastic Encapsulation
Answer: Through-Silicon Via
TSV (Through-Silicon Via) creates vertical electrical connections through silicon dies, enabling 3D chip stacking for higher bandwidth, lower power, and smaller footprint. Critical for advanced packaging in HPC, mobile, and AI chips. India focuses on ATMP capabilities.